Bauer NDT X3000A Inspection BGA:-

There are so many machines and reworking stations are providing the reworking and reballing solutions for the help of the companies which are using PCB and microprocessor oriented machines like PCs, laptops, play station and mobile phones. These machines are more common and widely use in the world according to the type and reworking environment also with these machines there are some new technologies comes in the market and these machines and technologies are much more useful for the X-Ray inspection here I am talking about Bauer NDT X3000A X-ray inspection machine which is a new technology and specially made for the help of investigating BGA, void and separation on PCB and it has a high and more proficient X-Ray tube.  This is a Bauer NDT X3000A X-ray inspection machine with a Ray source using 100kV, fantastic identification occurs apply to PCBA solder joint evaluation; electronic connectors, semiconductors, electronic parts; nourishments, pharmaceuticals and LED; distinguish minimal metal castings and distinctive ranges likewise this is more correct and a programmed machine that helps us to do errands quite effectively.

It is a high definition and a high determination digital video imaging system and with a quite a high changeable show and working stage with an adaptable stacking stage could be turned 360 degrees with programmed lift tick marks. The NDT X-Ray Inspection Equipment is made to examine BGA , void and detachment on PCB and it has a high and more capable X-Ray tube than whatever accessible machine and it is astoundingly diagram for the people who necessity to evaluate the BGA and it is more ensured to use. This machine is modern class and more worthy in all over the place you need to handle the issues as it gives a part screen innovation for 100% precise position of BGA chips.

Its measurements are 940*1504*1630 mm with a weight of 926kg and a force supply of Single stage AC  110~230v/50~60hz and you can work it by keyboard/mouse/navigation positioning. It has WINDOWS XP Professional PC framework with a 2 GB memory and Intel Pentium framework and comes about by applying Testable Weight of example of 5kg and the Polaroid spec are Image Intensifier and Digital CCD 25 frames/m. The X-Ray Tube is a shut tube with a central spot of 5UM likewise X-Ray tube Voltage is 100 KV and a Magnification of 125 geometric /1200 systems. Its Image Resolution is 10 LP/cm (light match for every cm) and territory of the picture is 460mm*370mm. It is an Automatic filtering route and set the numbering of BGA Auto Inspection, estimation and air pocket likewise the Temperature, Humidity is 0-30°c 10-90. 

It likewise has a discretionary 130kV shut tube fluorescent tubes with little metal throwing industry to meet the provision quite effortlessly. Its programming configuration is truly easy to understand and with a straightforward interface it gets to be less demanding to work with a rodent control however it has a high cost yet as per the profits it furnishes it is not unreasonable.

Bauer BGA RW-SV550:-

BGA machines and BGA rework station are the best machines in the world providing the rework solution for the PCB and the microprocessor also there are many producers of these BGA machines in the world that are providing these machines but I never find the BGA and BGA rework stations like the Bauer RW-SV550 BGA rework station it is the best solution for the reworking problem and is an auto pick and place BGA rework station that is the best one of the available options in the market it is a newly developed machine that is best suitable for the reworking issues we are facing in these days and I am sure you really like the working of this rework station because it is the only solutions for the reworking problems. Here I have a little detail of this machine. 

Bauer RW-SV550 BGA refurbish station accompanies 7.2 inch high definition touch screen. Color optical framework with capacities, for example, partial vision, zooms in and micro alteration, self adjusts and menu operation, can work with max up to 70x70 mm PCB it is equipped with diverse alloy hot air nozzles customizable and simple to restore.

Here are a few features of this newly developed Bauer BGA RW-SV550 BGA rework station:

Hot air warmer head and mounting head are outlined 2 in 1, determined by step electric engine and have both the auto patching and mounting capacity likewise three warmers (upper/lower hot air radiator, bottom IR radiator) heating autonomously, now is the right time and temperature  might be shown digitally on touch screen. Upper warmer is portable, helpful for operation additionally huge versatile base IR warming range and PCB cinches could be balanced plus X & Y table adaptable to the max PCB size it can deal with up to 550*500mm, Powerful cross stream fans cool the bottom warming zone quickly with stable speed. It likewise has a shade optical framework with capacities of partial vision, zoom in or out and micro modifies, it is furnished with variation location unit with auto center and programming operation work, 27 X optical centers, ready to revise BGA scrutinized to 70*70mm.

Implanted modern PC, touch screen interface, PLC control, ongoing profile show equipped to show set profile and 5 for all intents and purpose tried profile in the meantime it can investigate the five basically tried profiles by means of color LCD screen and A Built-in vacuum pump, 60 °rotation in φ point, mounting spout is micro changeable likewise have 8 sections of temperature up (down) and 8 fragments steady temperature control. Its profile sparing is boundless in the modern PC. Suction nozzle can distinguish material and mounting height immediately, and can control the pneumatic force inside a little go of 30-50g. It is furnished with distinctive hot air nozzles, simple to displace and fit to find in any angle.

It has a PCB dimension of W20*D20~W550*500 with a PCB thickness of 0.5~4mm, its working table adjustment is ±120mm Forward and backward, ±80mm Left and right with a temperature control of K-type Thermocouple and is a Close Cycle Controlled and an area heater far infrared is 3600W, its top heater has hot gas of 1200W and a bottom heater hot Gas of 800W. the PCB location way is the outer power supply with a single phase 220v,50/60Hz the BGA dimension: 1*1~70*70mm also it has a minimum pitch of BGA ball around 0.15mm with a placement precision of ±0. 02mm and the maximum BGA weight is 300g. Machine dimension of this Bauer BGA RW-SV550 is L850*W750*H630 and a Weight of Approximately 80kgs. Split screen technology for 100% accurate placement of BGA chips. This machine is industrial class and has a single disadvantage of High Price.

Why BGA Rework Station and BGA Machines are The Best:-

A Ball Grid Array (BGA)  is a surface mount technology specially make to use for the integrated circuit and it is used to repair the permanently mount devices like the motherboard and the  microprocessors of the PCs, Laptops, play station, XBOX, MP4 and MP5 players and mobile phones if we remember in our past we use too mobile phones of big size and that only use for the phone calls and messages but now we have compact, and small smart phones devices that are much more faster and user friendly. This change is only due to the development of BGA technology and it is a fast and more rapid improvement in the technology. BGA is derived from the word Pin grid array (PGA) and it is the most improved technology than the PGA. A BGA provides more interconnecting pins that we can put in a dual in line package. We can use the whole bottom surface of the machine rather than a parameter that can improve the efficiency and increase the performance of the machines.

Fastening of BGA units obliges exact control and is normally completed via automated courses of action. BGA mechanisms are not appropriate for socket mounting. A further focal point of BGA bundles over bundles with isolated leads is the more level warm safety between the bundle and the PCB. This permits hotness produced by the incorporated circuit inside the bundle to stream all the more effectively to the PCB, counteracting the chip from overheating. The shorter an electrical channel, the easier its unwanted inductance, a property which causes unwanted bending of signs in fast electronic circuits. BGA with their quite short separation between the bundle and the PCB, have low lead inductances, providing for them better electrical execution than stuck apparatuses. The BGA is an answer for the issue of generating a scaled down bundle for an incorporated circuit with frequent pins. Pin grid array and double in-line surface mount bundles were being generated with more pins, and with diminishing separating between the pins, yet this was initiating challenges for the patching procedure. As package pins got closer together, the threat of unintentionally crossing over adjoining pins with patch developed. BGA don't have this issue when the solder is manufacturing plant connected to the package.

There are many BGA rework stations are available in the market that are providing the best for the people which are working for making and repairing the PCB, and microprocessor but all the machine are manual and need more care for the reworking because it is manual and a very little mistake can leads to the big damage so I recommend to use the auto pick and place or a full automatic BGA machine that is easy to use and do not require more concentration. If you have this type of machines in your reworking area it is the best idea to do your work with the best technology available in the market.