Why BGA Rework Station and BGA Machines are The Best:-

A Ball Grid Array (BGA)  is a surface mount technology specially make to use for the integrated circuit and it is used to repair the permanently mount devices like the motherboard and the  microprocessors of the PCs, Laptops, play station, XBOX, MP4 and MP5 players and mobile phones if we remember in our past we use too mobile phones of big size and that only use for the phone calls and messages but now we have compact, and small smart phones devices that are much more faster and user friendly. This change is only due to the development of BGA technology and it is a fast and more rapid improvement in the technology. BGA is derived from the word Pin grid array (PGA) and it is the most improved technology than the PGA. A BGA provides more interconnecting pins that we can put in a dual in line package. We can use the whole bottom surface of the machine rather than a parameter that can improve the efficiency and increase the performance of the machines.

Fastening of BGA units obliges exact control and is normally completed via automated courses of action. BGA mechanisms are not appropriate for socket mounting. A further focal point of BGA bundles over bundles with isolated leads is the more level warm safety between the bundle and the PCB. This permits hotness produced by the incorporated circuit inside the bundle to stream all the more effectively to the PCB, counteracting the chip from overheating. The shorter an electrical channel, the easier its unwanted inductance, a property which causes unwanted bending of signs in fast electronic circuits. BGA with their quite short separation between the bundle and the PCB, have low lead inductances, providing for them better electrical execution than stuck apparatuses. The BGA is an answer for the issue of generating a scaled down bundle for an incorporated circuit with frequent pins. Pin grid array and double in-line surface mount bundles were being generated with more pins, and with diminishing separating between the pins, yet this was initiating challenges for the patching procedure. As package pins got closer together, the threat of unintentionally crossing over adjoining pins with patch developed. BGA don't have this issue when the solder is manufacturing plant connected to the package.

There are many BGA rework stations are available in the market that are providing the best for the people which are working for making and repairing the PCB, and microprocessor but all the machine are manual and need more care for the reworking because it is manual and a very little mistake can leads to the big damage so I recommend to use the auto pick and place or a full automatic BGA machine that is easy to use and do not require more concentration. If you have this type of machines in your reworking area it is the best idea to do your work with the best technology available in the market.